<sup>188</sup> Re Tailor Made Skin Patch for the Treatment of Skin Cancers and Keloid: Overview and Technical Considerations

Authors

  • Jaya Shukla Department of Nuclear Medicine and PET, Post Graduate Institute of Medical Education and Research, Chandigarh 160012 India
  • Bhagwant Rai Mittal Department of Nuclear Medicine and PET, Post Graduate Institute of Medical Education and Research, Chandigarh 160012 India

Keywords:

Keloid, BCC, SCC, Re-188 tin colloid, Skin patch

Abstract

The incident of non-melanoma skin cancer and keloid is increasing and is associated with pain, itch and discomfort. Several methods have been used for the treatment but are associated with high recurrence rate. Tailor made Rhenium-188 (188Re) skin patch is convenient, non-invasive and safe method for the treatment. The recurrence is not noted during follow up period of more than three years.

Downloads

Published

2017-07-31

Issue

2017: Special Issue - 188Rhenium, the new Workhorse of Radio Nuclide Therapy: Concepts to Clinical Use

Section

Articles

License

Policy for Journals/Articles with Open Access

Authors who publish with this journal agree to the following terms:
    1. Authors retain copyright and grant the journal right of first publication with the work simultaneously licensed under a Creative Commons Attribution License that allows others to share the work with an acknowledgement of the work's authorship and initial publication in this journal.

  1. Authors are permitted and encouraged to post links to their work online (e.g., in institutional repositories or on their website) prior to and during the submission process, as it can lead to productive exchanges, as well as earlier and greater citation of published work

Policy for Journals / Manuscript with Paid Access

Authors who publish with this journal agree to the following terms:
    1. Publisher retain copyright .

  1. Authors are permitted and encouraged to post links to their work online (e.g., in institutional repositories or on their website) prior to and during the submission process, as it can lead to productive exchanges, as well as earlier and greater citation of published work .